Heat Transfer In Electronics: A BEM Approach
Price
Free (open access)
Transaction
Volume
20
Pages
7
Published
1998
Size
483 kb
Paper DOI
10.2495/EBEM980191
Copyright
WIT Press
Author(s)
G. de Mey
Abstract
This paper deals with some particular problems of heat trans- fer by conduction in microelectronic components. It turns out that for all the equations, the fundamental solution is known in a closed analytical form, making the link with the Boundary Element Method straightforward. 1 Introduction This paper deals with two different topics. First of all with ther- mal aspects in electronics design and secondly with the boundary
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