Mixed Numerical Scheme Solution For Dropwise Evaporative Cooling
Price
Free (open access)
Transaction
Volume
5
Pages
8
Published
1994
Size
768 kb
Paper DOI
10.2495/HT940561
Copyright
WIT Press
Author(s)
P. Tartarini & M. di Marzo
Abstract
Mixed numerical scheme solution for dropwise evaporative cooling P. Tartarini" & M. di Marzo& "Istituto di Fisica Tecnica, Universitd di Bologna, viale Risorgimento, 2, Bologna 40136, Italy ^Department of Mechanical Engineering, University of Maryland, College Park, Md 20742, (76L4 ABSTRACT A numerical code for the prediction of evaporative cooling of solid surfaces induced by a gently deposited water droplet is presented. The code is based upon a solid-liquid coupled model which predicts the droplet evaporation and the solid surface cooling for materials with thermal conductivity spanning over more than two orders of magnitude. The numerical solution of the conduction equation, which links a control volume method (CVM) used for the liquid and a boundary element method (BEM) used for the solid, is presented. The necessity of using the BEM for the solid domain is particularly stressed. INTRODUCTION The evaporation of a liquid droplet on a hot solid su
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