Author(s)

S.-H. Lee, J.S. Kim, Y. Eugene Pak and D. Kwon

Abstract

Microfracture characterization through crack diagnosis at sharp notch of smart microsystem materials using the electrostatic comb test device S.-H. Lee\ J.S. Kim% Y. Eugene Pak^ and D. Kwon* ^School of Materials Science and Engineering, Seoul National University, Korea "'Micro Systems Lab., Samsung Advanced Institute of Technology, , Korea Abstract As the size of a mechanical structure used in smart microsystems such as sensors and actuators becomes susceptible to defects, the effect of such defects on structural strength has a vital importance. So, the electrostatically actuated test device is presented to evaluate microfracture properties through a microcrack diagnosis of micromaterials forming the microsystems for improvement of micromechanical reliability. The designed test device consists of comb drives for loading and a suspending beam for testing. The sharp notch is introduced to the suspending beam in the test device. On the basis of the electrostatic comb t

Keywords