Author(s)

G. Kelly, J. Alderman, C. Lyden & J. Barrett

Abstract

The encapsulation stress induced on a micromachined silicon membrane pump encapsulated in plastic is quantified. A combination of numerical and analytical techniques are used to deduce limits for the maximum per- missible diemensions of a membrane subject to encapsulation stresses. The approach uses finite element techniques to estimate the membrane stress due to packaging followed by an elastic stability theory approach to deter- mining the critical buckling load for a biaxially loaded plate. Introduction Microsystem technologies, and in particular micromachining has allowed the rapid development and miniaturisation of many different types of sen- sors and actuators. The benefits of this technology can be seen in the context of contributing to cost reduc

Keywords