Author(s)

A. Gotz, C. Cane & E. Lora-Tamayo

Abstract

Microsystems often require special attention to the thermal aspects, as they frequently integrate severe heat sources together with electronics. When Finite Element Method programs are used for the solution of these problems, difficulties different from normal ICs are encountered, like, for example, thin membranes with huge aspect ratios and natural and forced convection in microcavities. Some of these aspects are discussed for the example of ANSYS 5.1 simulations of a 3-D multichip microsystem including a thermopneumatic micropump.

Keywords