Boundary Element Analysis Of Interface Stress State In A Bonded Viscoelastic Thin Film
Price
Free (open access)
Transaction
Volume
25
Pages
9
Published
1999
Size
620 kb
Paper DOI
10.2495/BE990081
Copyright
WIT Press
Author(s)
Sang Soon Lee
Abstract
This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate as the film absorbs moisture from the ambient environment. The time-domain boundary element method is employed to investigate the behavior of interface stresses. The order of the free-edge singularity is obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered. 1 Introduction Polymeric films such as polyimide are extensively used in electronic industry as dielectric insulating layers. Thin films deposited on a substrate absorb moisture from the ambient environment, which in
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