Boundary Element Methods For Capacitance And Substrate Resistance Calculations In A VLSI Layout Verification Package
Price
Free (open access)
Transaction
Volume
3
Pages
8
Published
1993
Size
752 kb
Paper DOI
10.2495/EL930391
Copyright
WIT Press
Author(s)
T. Smedes, N.P. van der Meijs & A.J. van Genderen
Abstract
Boundary element methods for capacitance and substrate resistance calculations in a VLSI layout verification package T. Smedes, N.P. van der Meijs, A.J. van Genderen Delft University of Technology, Faculty of Electrical Emgmeermg, f 0 Boz 50&?, ATI-ggOO &4 D#, The Netherlands ABSTRACT In this paper we describe the application of the Boundary Element Method to the layout verification of VLSI Designs. We describe the methods for the cal- culation of interconnection capacitances and substrate resistances with the use of problem specific Green's functions. Emphasis is on computational efficiency and practical accuracy. The methods are implemented in the layout extractor Space (van der Meijs [1 ]). INTRODUCTION Designers of modern VLSI circuits rely heavily on layout-to-circuit extractors, which translate a chip layout into an equivalent network suitable for electrical verification of their layouts. Because of the growing influence of parasitic ele- ments, such extractors
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