Author(s)

G.N. Ellison

Abstract

Invited Paper Thermal analysis of microelectronic packages and printed circuit boards using ana analytic solution to the heat conduction equation G.N. Ellison Electronics Research Laboratory, Tektronix Laboratories, inc., Beaverfon, Oregon 27077-00(%, ABSTRACT This paper provides an overview of the solution and application of the three-dimensional heat conduction equation for a rectangular-shaped, multilayer structure with discrete surface heat sources. A Fourier series expansion is used to represent both the heat source function and temperature solution. Boundary conditions consist of insulated edges and Newtonian surface cooling. Computer programs based this method are used to demonstrate the solution of a heat sinked hybrid circuit package mounted on an epoxy glass circuit board. NOMENCLATURE a,b Substrate x,y dimensions, m t Thickness, m c z-coordinate of layer interface, m T Temperature, °C F Heat transfe

Keywords