Stress Intensity Factor Analysis For An Interface Crack Between Dissimilar Isotropic Materials Under Thermal Stress
Price
Free (open access)
Transaction
Volume
26
Pages
10
Published
2000
Size
907 kb
Paper DOI
10.2495/DM000061
Copyright
WIT Press
Author(s)
T. Ikeda & C.T. Sun
Abstract
Stress intensity factor analysis for an interface crack between dissimilar isotropic materials under thermal stress T. Ikeda* & C. T. Sun* I Chemical Engineering Group, Department of Materials Process Engineering, Graduate School of Engineering, Kyushu University, Japan 2 School of Aeronautics and Astronautics, Purdue University, USA Abstract Thermal stresses, one of the most important causes of interfacial failure between dissimilar materials, arise from different coefficients of linear thermal expansion. An efficient numerical procedure in conjunction with the finite element method (FEM) for the stress intensity factor (SIF) analysis of interface cracks under thermal stresses is presented. The crack closure integral method is modified using the superposition method. The SIF analyses of some interface crack problems under mechanical and thermal loads are demonstrated. Very accurate mode separated SIF's are obtained. 1 Introduction The stress intensity factors (SIF'
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