Finite Element Analysis On Coarse Grained Vector Machines Of Residual Stresses In Plastic IC Packages During Surface Mounting Processes
Price
Free (open access)
Volume
18
Pages
13
Published
1997
Size
913 kb
Paper DOI
10.2495/HPC970191
Copyright
WIT Press
Author(s)
Sung Yi, Harry H. Hilton & M. Fouad Ahmad
Abstract
Finite element analysis on coarse grained vector machines of residual stresses in plastic 1C packages during surface mounting processes Sung Yi*, Harry H. Hilton^ & M. Fouad Ahmad* "School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Republic of Singapore. ^Aeronautical and Astronautical Engineering Department and National Center for Super computing Applications, University of Illinois at Urbana-Champaign, 104 South Wright Street, Urbana, 71 67&07-2P3J U&4 Email: h-hilton@uiuc.edu Abstract Finite element analyses are utilized on a CRAY T94 to calculate hygro- thermally induced anisotropic viscoelastic deformations and stresses in plas- tic 1C packages during surface mounting processes, which is an interdisci- plinary coupled hygro-thermo-structure interaction problem. The subrou- tine for element stiffness calculation is dominated by vector operations and achieves about 432 million floating-point operations per second
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