WIT Press


Finite Element Analysis On Coarse Grained Vector Machines Of Residual Stresses In Plastic IC Packages During Surface Mounting Processes

Price

Free (open access)

Volume

18

Pages

13

Published

1997

Size

913 kb

Paper DOI

10.2495/HPC970191

Copyright

WIT Press

Author(s)

Sung Yi, Harry H. Hilton & M. Fouad Ahmad

Abstract

Finite element analysis on coarse grained vector machines of residual stresses in plastic 1C packages during surface mounting processes Sung Yi*, Harry H. Hilton^ & M. Fouad Ahmad* "School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Republic of Singapore. ^Aeronautical and Astronautical Engineering Department and National Center for Super computing Applications, University of Illinois at Urbana-Champaign, 104 South Wright Street, Urbana, 71 67&07-2P3J U&4 Email: h-hilton@uiuc.edu Abstract Finite element analyses are utilized on a CRAY T94 to calculate hygro- thermally induced anisotropic viscoelastic deformations and stresses in plas- tic 1C packages during surface mounting processes, which is an interdisci- plinary coupled hygro-thermo-structure interaction problem. The subrou- tine for element stiffness calculation is dominated by vector operations and achieves about 432 million floating-point operations per second

Keywords