Growth Behavior Of Nitride Layers Formed On Chromium Electrodeposit In Plasma-nitriding
Price
Free (open access)
Transaction
Volume
43
Pages
10
Published
2003
Size
469.20 kb
Paper DOI
10.2495/MC030301
Copyright
WIT Press
Author(s)
S. C. Kwon, K. S. Nam, J. Y. Eom, V. Shankar Rao & H. S. Kwon
Abstract
The structural and compositional analysis on nitrides formed on an electroplated hard Cr layer during plasma-nitriding was conducted, and its growth kinetics was examined as a function of the plasma-nitriding temperature and time in order to establish a computer simulation model prediction for the growth behavior of the Cr-nitride layer. The Cr-nitrides formed during the plasma-nitriding at 550- 720 O C are composed of outer CrN and inner Cr2N layers. A nitrogen diffusion model in the multi-layer, based on fixed grid Finite Difference Method was applied to siinulate the growth kinetics of Cr-nitride layers. By measuring the thickness of
Keywords