A Micromechanical Model For Coupled Interaction Of Thermomechanical And Corrosion Fatigue In Microelectronics Thin-film Metallizations.
Price
Free (open access)
Transaction
Volume
33
Pages
10
Published
2001
Size
727 kb
Paper DOI
10.2495/SURF010401
Copyright
WIT Press
Author(s)
H.M. Shodja
Abstract
A micromeehanical model for coupled interaction of thermomechanical and corrosion fatigue in microelectronics thin-film metallizations H. M. Shodja Department of Civil Engineering Sharif University of Technology, Iran. Abstract Having studied the intergranular crack nucleation in bicrystalline materials under fatigue [1], the concepts are extended to innovative treatise of crack initiation in thin-film metallizations under coupled interaction of thermomechanical fatigue (TMF) and corrosion. The pile-up of dislocations under thermal cycling and diffusion of corrosive agents have interacting effects in accelerating crack nucleation. It is shown that the corresponding evolutionary partial differential equation (PDE), which governs diffusion of the corrosive agent, contains two terms that involve the first and second spatial derivatives of hydrostatic pressure. Through dependence of the hydrostatic pressure on normal stresses caused by dislocations within th
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